Description

Key Features

  – Mission-critical applications

– High Availability Storage

Appliance Platform

Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:

1. Dual Socket P (LGA 3647) support

2nd Gen. Intel® Xeon® Scalable

processors (Cascade Lake/Skylake)^‡

2. 16 DIMMs; up to 4TB 3DS ECC

DDR4-2933MHz^† RDIMM/LRDIMM

3. 2 PCI-E 3.0 x16 slots

4. Flexible Networking support via SIOM;

Dedicated IPMI 2.0 LAN

5. 4 Hot-swap 2.5″ SAS3 drive bays

6. Broadcom 3008 SAS3 controller;

SW RAID

7. 2 SuperDOM onboard or optional

2 M.2 carrier

8. Up to 1000W Redundant Power Supplies

Titanium Level (96%)